Александра Лисица (Редактор отдела «Забота о себе»)
以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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As usual with Samsung’s yearly refreshes, the real decision may come down to pricing and discounts. If the Galaxy S25 sees significant price cuts, it could remain the better value. But at similar prices, the Galaxy S26 is the safer long-term buy.
"There is something tactile about it when you hold it," said Dr Sara Machin, the finds lead for Access +, the consortium of archaeologists in charge of this project. "Even now it fits snugly in my hand."